Packaging
TCPL — PACK EXPO Chicago 2024
Standika designed and built a packaging booth for TCPL at PACK EXPO Chicago 2024 in Chicago at the McCormick Place. The stand was produced on a modular aluminum structure with printed SEG fabric graphics, then installed and dismantled by our own crew as a turnkey booth.
| Client | TCPL |
|---|---|
| Show | PACK EXPO Chicago 2024 |
| City | Chicago |
| Venue | McCormick Place |
| Industry | Packaging |
| Year | 2024 |
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Custom Booth